Key features

• Unified, industry standard, well debugged and documented ultra-high performance platforms minimizing total design time and final cost for end user PICMG® MicroTCA®, AdvancedTCA® and stand-alone/embedded applications
• Xilinx Zynq UltraScale+ MPSoC EG FPGA (XCZU11EG, XCZU17EG, XCZU19EG) with six ARM® cores (FPGA/PS), high density logic (FPGA/PL) and pools of 28Gbps/32Gbps (GTY) and 16Gbps (GTH) transceivers
• VITA 57.4-2018 FMC+ site for user adopted I/O via FMC/FMC+ HSPC/HPC/LPC submodule (160 I/O, 24x 16Gbps GBTs) upon user application requirements (AD/DA, SFP+, QSFP+, RF, etc.)
• 384Gbps maximum aggregated bandwidth for real-time data I/O via FMC+ GBT ports
• AMC Fabric-DEFG ports 4-7/8-11 for in-chassis AMC-to-AMC real-time data transfer using AMC.2 10GbE, 40GbE, 100GbE; AMC.4 Serial RapidIO (20Gbps, 50Gbps, 100Gbps); AMC.1 PCIe (32Gbps, 64Gbps, 128Gbps) protocols
• Optional support for AMC ports 12-15/17-20 (4x 28Gbps, "free" protocol) for high-speed in-chassis AMC-to-AMC real-time data transfer
• AMC Fabric-B ports 2-3 (AMC.3 6Gbps SATA/SAS ) for communication with adjacent HDD/SSD AdvancedMC (AMC) modules
• 544Gbps maximum aggregated bandwidth for AMC-to-AMC real-time data transfer
• AMC Fabric-A 1GbE ports 0-1 from PS for remote device control and in-chassis AMC-to-AMC control communication
• 64-bit DDR4 (up to 8GB) for FPGA/PS
• 64-bit DDR4 (up to 8GB) and 32-bit DDR4 (up to 4GB) banks for FPGA/PL
• 2Gb NOR FLASH for FPGA/PS-PL applications and data
• 4Mb NVRAM memory for critical applications and data
• Removable M.2 2280 SATA3 SSD module (up to 2TB) for large data arrays and FPGA/PS-PL applications
• Front panel MicroSD card slot (up to 2TB) for FPGA/PS-PL applications, large data arrays and data transfer
• Front-panel LEDs for FPGA/PS and FPGA/PL applications
• FPGA/PL 8-bit FPGA XGPIO port for optional connection to external devices
• High-performance MMC controller with proprietary TAMMC® Gen2 high-speed MMC-kernel, power/temperature monitoring, status indication and more, all for reliable and safe device operation and protection
• USB UART ports from FPGA/PS and MMC for remote device management
• Stand-alone operation from +12V power supply for embedded applications
• Commercial and industrial operating temperature ranges
• Complies PICMG® 3.0 Rev.3.0, MicroTCA.0 R1.0, AMC.0 R2.0, IPMI 1.5, VITA® 57.1-2008 (R2010) specifications

Development tools

• Embedded high-speed USB FPGA JTAG emulator (equivalent to MIRAGE-UXF USB JTAG emulator for Xilinx FPGA) with external JTAG emulator option
• Unified TASDK® tools for TORNADO AMC modules with high-level API for development of ARM applications, PL bitstreams and host PC Windows/Linux and Android® remote control applications
• Linux, FreeRTOS and "bare-metal" API for ARM applications
• TASDK/ThreadX toolkit with pre-certified Microsoft Azure ThreadX® RTOS for high-performance demanding applications
• Demo projects for device tests and user projects startup
• Xilinx SDK and Vivado tools for development of FPGA/PS and FPGA/PL applications

Applications

• Telecommunication and telephony
• RF and digital radio
• Stand-alone and distributed DSP systems
• Image processing
• Radars and astrophysics
• Industrial, instrumentation and medical

** Notes

1. MicroLAB Systems can modify its products to meet special customer requirements. MOQ may apply. Contact MicroLAB Systems for more details.
 

TORNADO-AZU+/FMC+ (F/S) AdvancedMC (AMC) module
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Block diagram of TORNADO-AZU+/FMC+ AdvancedMC (AMC) module
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TORNADO-MTCA® modular DSP system including TORNADO-AZU+/FMC+ AMC-module with AD/DA FMC-submodule, TORNADO-A6678/FMC AMC-module with AD/DA FMC-submodule, TORNADO-ARX1 RF AMC-module and T/AX-DSFPX AMC-module with 10GbE SFP+ LAN/WAN ports, all installed into MicroTCA® 1U chassis with 10GbE switching fabric
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TORNADO-mMTCA® modular DSP mini-system including TORNADO-AZU+/FMC+ AMC-module with AD/DA FMC-submodule and T/AX-DSFPX AMC-module with 10GbE SFP+ LAN/WAN ports, all installed into dual-slot MicroTCA® mini chassis with passive backplane
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