Key features

• Ultra-High Performance DSP/FPGA AdvancedMC (AMC) module for PICMG® MicroTCA®/AdvancedTCA® and Standalone/Embedded applications
• 8-core Texas Instruments TMS320C6678 DSP (1.25GHz 320GMAC, 160GFLOPS) and Xilinx Virtex-7 FPGA (XC7VX330T, XC7VX415T, XC7VX690T)
• High-speed industry standard I/O AMC interfaces (10GbE, 40GbE, 1GbE, Serial RapidIO, PCIe) and 10Gbps+ SFP+
• Meets PICMG® 3.0 Rev.3.0, AMC.0 R2.0 and IPMI v1.5 specifications
• Installs into MicroTCA® chassis and AdvancedTCA® mainboard
• Stand-alone operation and embedded applications

Details

• AMC high-speed multi-lane Fabric-D/E/F/G Fat Pipe ports #4..#7 and #8..#11 (10GBASE-BX4 (XAUI), 40GbE (4x 10GbE), 4x 5Gbps Serial RapidIO, 4x 5Gbps PCIe) from FPGA and AMC Fabric-A 1GbE SGMII port #0 from DSP for AMC management
• DSP-to-FPGA communication via 4x channel 5Gbps Serial RapidIO I/F for the total or 40Gbps throughoutput
• FPGA 10Gbps+ SFP+ port for external I/O
• Up to 8GB DDR3 DSP memory
• 1Gb FLASH for DSP bootloader, system monitor, user applications and FPGA bitstreams
• DSP EMIF16 bus (30MWPS) for access to FLASH and FPGA
• DSP 1GbE RJ45 and 155kBaud COM/RS232C ports for remote module management
• User controlled front-panel DSP and FPGA LEDs for indication of DSP/FPGA user application status
• Optional XDEBUG front-panel connector for DSP/FPGA JTAG emulators and DSP/MMC remote consoles
• MMC controller with MicroLAB Systems TAMMC® MMC-kernel and high-speed monitoring of on-board power supplies and temperatures for reliable module operation and protection
• Stand-alone/embedded operation from external +12V power and external communication via 10GbPS+ SFP+, 1GbE RJ45 and COM/RS232C ports
• Available in Mid-size (M/S) and Full-size (F/S) AMC form-factors

Development Tools

• TI Code Composer Studio tools and MicroLAB Systems MIRAGE-NC2/NE1 JTAG emulators for TI DSP
• Xilinx ISE/Vivado tools and IP for FPGA
• Unified TASDK® tools with high-level API function libraries, bootloader and system monitor for development of user DSP and PC applications and system control
• TASDK/ThreadX toolkit with pre-certified Microsoft Azure ThreadX® RTOS for high-performance demanding applications
• DSP and FPGA demo projects for tests and user application basis

Applications

• Telecommunication
• RF and digital radio
• Cell telephony
• General stand-alone and distributed DSP applications
• Image processing
• Radars and astrophysics
• Industrial, telemetry and instrumentation
• Medical

** Notes

MicroLAB Systems can modify this product to meet special customer requirements. MOQ may apply. Contact MicroLAB Systems for more details.

TORNADO-A6678® mid-size (M/S) AdvancedMC (AMC) module
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TORNADO-A6678® Block Diagram
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TORNADO-MTCA® modular DSP system with three F/S TORNADO-A6678® AMC-modules in 19" 1U 6-slot MicroTCA® chassis with 10GbE backplane switch
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TORNADO-RxMTCA® modular Radio-monitoring system with high-performance DSP comprising two TORNADO-ARX1® radio-processing AMC-module, M/S TORNADO-A6678® AMC-module and T/AX-DSFPX network AMC-module in 19" 1U 6-slot MicroTCA® chassis with 10GbE backplane switch
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TORNADO-MTCA® modular DSP system with four M/S TORNADO-A6678® AMC-modules and two T/AX-DSFPX network AMC-modules in 19" 1U 6-slot MicroTCA® chassis with 10GbE backplane switch
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TORNADO-RxmMTCA® modular Radio-monitoring mini system with high-performance DSP comprising TORNADO-ARX1® radio-processing AMC-module and F/S TORNADO-A6678® AMC-module in 2-slot MicroTCA® mini-chassis with passive backplane
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TORNADO-mMTCA® modular DSP mini system with F/S TORNADO-A6678® AMC-module and T/AX-DSFPX network AMC-module in 2-slot MicroTCA® mini-chassis with passive backplane
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TORNADO-A6678® AdvancedMC (AMC) module as an embedded controller
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TA6678/X330/D2G/F1G/FS
TA6678/X330/D2G/F1G/MS

TA6678/X415/D2G/F1G/FS
TA6678/X415/D2G/F1G/MS

TA6678/X690/D2G/F1G/FS
TA6678/X690/D2G/F1G/MS